| 摘要 |
The present invention relates to a spacer-integrated diaphragm, in which spacers are integrated with the diaphragm, in order to reduce the number of components and manufacturing processes needed and remove parasitic capacitance. A characterizing feature of the spacer-integrated diaphragm of the present invention is that it has an integrated structure comprising a diaphragm of a flat conductive film, and thermally insulative spacers formed so as to protrude on peripheral portions of the diaphragm through a PSR (Photo Solder Resist) printing process. The spacers are formed with a plurality of holes to remove parasitic capacitance, the diaphragm has a rectangular flat shape with round edges, and the spacers are formed near the four edges of the rectangular flat shape. In the spacer-integrated diaphragm of the present invention, because the spacers are formed of a PSR (Photo Solder Resist) material and are also formed with a plurality of holes, the present invention can prevent unnecessary parasitic capacitance from occurring and improve sound quality, and, because the diaphragm and the spacers are integrally formed, the present invention can reduce the number of processes needed when a condenser microphone is assembled and reduce the number of components required, thereby reducing manufacturing costs.
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