| 摘要 |
A film substrate in a mounting structure of electronic components has positioning holes capable of positioning the electronic components passing therethrough. One surface of each of the electronic components which are inserted and positioned in the positioning holes protrudes from one surface of the film substrate, and the other surfaces thereof are positioned in the positioning holes, respectively. Conductive patterns are formed on the other surface of the film substrate and are electrically connected to the other surfaces of the electronic components positioned in the positioning holes.
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