PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A PCB and a manufacturing method thereof are provided to accurately test eccentricity of an opening part of a solder resist layer and a pad of a unit region. CONSTITUTION: A PCB(30) is divided into a dummy region(36) and a unit region in which a plurality of unit substrates is formed. A pad is formed in the unit region(32). The PCB includes a test target and a solder resist layer. The test target(40) is formed in the dummy region. The solder resist layer is formed in the unit region and the dummy region. An opening part and a test hole are formed in the solder resist layer. The opening part exposes the pad. The test hole(42) has a dimension larger than the test target, and exposes the test target.