| 摘要 |
PURPOSE: A method for preparing re-workable paste for flip chip attachment is provided to produce re-workable paste which is applicable to a SAW filter flip chip, a small display device panel, photoelectronic part moudule, optical fiber and a heat treatment temperature-sensitive LTCC substrate. CONSTITUTION: A method for preparing re-workable paste for flip chip attachment comprises the steps of: pulverizing a PbO-Bi2O3-B2O3-ZnO-SiO2 based mother material with specific gravity 7.2±0.3 g/cc and Tg 250±20 °C in nanoscale particles of an average particle size of D50=300nm; mixing the rized material and metal filler; and adding vehicle to the mixture to be prepared in a workable paste state. The PbO-Bi2O3-B2O3-ZnO-SiO2 based mother material comprises PbO 72-82 weight%, Bi2O3 6-10 weight%, ZnO 3-5 weight% and SiO2 1-3 weight%.
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