| 摘要 |
FIELD: chemistry. ^ SUBSTANCE: invention relates to the technology of producing composite materials based on low-molecular polymer compounds, specifically to polymer compositions for making adhesive and microwave energy absorbing coating and objects from the said composition, and can be used in chemical, metallurgical, radio electronic and electronic industries. The composition contains 16 to 25 wt % oligomeric binder, which is a product of reacting epoxy-silicone resin with tetrabutoxytitanium in ratio of 1:0.06 respectively. The binder is in a plastic state, with relative viscosity of 100 to 300 s. The composition also contains 14 to 20 wt % hardener in form of polyamide resin or iso-methyltetrahydrophthalic anhydride, and 70 to 75 wt % filler in form of powdered alloy of iron and aluminium in ratio of 7:1 respectively, with particle size of 10 to 30 micrometres. ^ EFFECT: wider functional capabilities, provision for high coefficient of absorption of microwave energy of the polymer composition while retaining mechanical strength, wide operating temperature range with high technological effectiveness. ^ 3 cl, 1 tbl, 5 ex |
