发明名称 COPPER-ZINC ALLOY ELECTROPLATING BATH AND PLATING METHOD USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a copper-zinc alloy electroplating bath capable of forming a plating layer which has the target composition and is homogeneous and brilliant in a wide range of electric current density without using a cyan compound, and to provide a plating method using the copper-zinc alloy electroplating bath. <P>SOLUTION: The copper-zinc alloy electroplating bath contains copper salt, zinc salt, alkali-metal pyrophosphate or alkali-metal tartrate, and nitrate ion. A concentration of the nitrate ion preferably is 0.001 to 0.050 mol/L, the pH of the copper-zinc alloy electroplating bath preferably falls into the range of 8 to 14 and, further, the copper-zinc alloy electroplating bath preferably contains at least one kind selected from amino acid or its salt in addition to copper salt, zinc salt, alkali-metal pyrophosphate or alkali-metal tartrate, and nitrate ion, wherein histidine is suitably used as the amino acid. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009270184(A) 申请公布日期 2009.11.19
申请号 JP20080124446 申请日期 2008.05.12
申请人 BRIDGESTONE CORP 发明人 SUGANO YUJI
分类号 C25D3/56;C25D7/06 主分类号 C25D3/56
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