METHOD FOR MANUFACTURING CIRCUIT BOARD, CIRCUIT BOARD, ACTIVE MATRIX CIRCUIT BOARD, AND IMAGE DISPLAY DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an inexpensive circuit board which has contact holes in an interlayer dielectric. SOLUTION: A method for forming the circuit board formed from multi-layer wiring and having the contact holes arranged in a matrix two-dimensionally, each contact hole connecting lower and upper electrodes via the interlayer dielectric. The method includes: a printing step in which printing is performed so that insulation pastes discharged from three or more paste discharging areas close to one another on a screen plate are two-dimensionally joined by spreading, thereby forming the contact hole, the screen plate having the paste discharging areas of predetermined shape arranged two-dimensionally; and a curing step in which the printed insulation paste are cured. COPYRIGHT: (C)2010,JPO&INPIT