| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a laminated semiconductor device with a sufficient yield by selecting a group of semiconductor devices arranged downward and semiconductor devices arranged upward. SOLUTION: The method of manufacturing the laminated semiconductor device 10 by laminating the semiconductor devices 11 includes: a first defect detection stage of detecting defective contents of a plurality of the semiconductor devices arranged downward; a second defect detection stage of detecting defective contents of a plurality of the semiconductor devices arranged upward; a device selection stage of selecting the group of the semiconductor devices arranged downward and the semiconductor devices arranged upward which are normally operated based on each defective content when the lower semiconductor devices and the upper semiconductor devices are laminated, out of the plural semiconductor devices arranged downward and the plurality of the semiconductor devices arranged upward; and a device lamination stage of laminating the selected semiconductor devices arranged downward and the selected semiconductor devices arranged upward. COPYRIGHT: (C)2010,JPO&INPIT
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