| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat spreader that increases the solder volume of a lower surface side of the heat spreader, that is, between the heat spreader and a substrate, lighten a stress, and increase a solder life. SOLUTION: When a semiconductor chip 3 is soldered to a substrate 2, in a heat spreader 1 interposed between the semiconductor chip 3 and the substrate 2 which are joined to each other by solders 4, 6 provided on the lower surface of the semiconductor chip 3 and on the upper surface of the substrate 2 a peripheral edge of the lower surface of the spreader at its substrate side and the lower edge of the side surface of the spreader are located at different positions, and the lower edge of the side surface is located at a position of the semiconductor chip side higher than the peripheral edge of the lower surface. COPYRIGHT: (C)2010,JPO&INPIT
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