| 摘要 |
A semiconductor wafer includes front and back side-chamfered surfaces asymmetric to each other with respect to a virtual line extending in a diametrical direction as the center, at half: the height of the outer edge surface. In addition, the height of the front side-chamfered surface is greater than that of the back side-chamfered surface, causing the front side-chamfered portion to be thicker than the back side-chamfered portion, thereby increasing the number of wafer reclamation cycles.
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