| 摘要 |
A stamped leadframe for a leadless package and a method of manufacturing the same are provided wherein the leadframe has at least a die pad, a frame, tie bars connecting the die pad to the frame and a plurality of leads. Each lead comprises a first portion and a second portion, and the second portion is connected substantially parallel to and displaced relative to the first portion by a distance that is less than the thickness of the first portion. Portions of the tie-bars and/or die pad may be similarly displaced. |
