| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a highly reliable mounting method of an IC chip. <P>SOLUTION: When a thermoplastic resin film 30 provided with through-holes 31 in positions corresponding to bumps 13-15, 22 and 23 is arranged between a printed wiring board 10 provided with the bumps 13-15 and an IC chip 20 provided with the bumps 22 and 23 and then the bumps 13-15 of the printed wiring board 10 and the bumps 22 and 23 of the IC chip 20 are bonded simultaneously with fusing the film 30 by heating and pressurizing to seal a space between the IC chip 20 and the printed wiring board 10 with resin, a film 16 composed of one of dicyclopentadiene, tetramethylpentadecane, dihydroanthracene, cyclooctane, and triphenylmethane being hydrocarbon compounds of which the C-H bond dissociation energy is 950 kJ/mol or less is arranged on surfaces of the bumps 13-15 of the printed wiring board 10, and bonding of the bumps and sealing with resin are performed with the film 16 between the bumps of the printed wiring board and the bumps of the IC chip by heating and pressurizing. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
