| 摘要 |
A low-profile module socket includes a socket housing, which is open at a module insertion surface and at an opposing surface, and includes peripheral wall parts and a plurality of contacts. Each contact connects at one end to a module on the inside of the socket housing and at another end to an electronic circuit substrate on the outside of the socket housing. Module securing members are formed from a metal plate and configured to contact and electrically ground a camera module provided in the socket housing. The module securing members latch at least to the pair of peripheral wall parts that oppose shield side wall parts arranged along an inner surface of the peripheral wall parts. A bottom surface plate part is formed in a single body with a pair of module securing members such that the module securing members mutually interlock at the module insertion opposing surface side.
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