WORKPIECE BREAKAGE PREVENTION METHOD AND APPARATUS
摘要
<p>Methods and apparatus for heat-treating a workpiece are disclosed. An illustrative method includes measuring deformation of a workpiece during heat-treating thereof, and taking an action in relation to the heat-treating of the workpiece, in response to the measuring of the deformation of the workpiece. The workpiece may include a semiconductor wafer. Taking an action may include applying a deformation correction to a temperature or reflectivity measurement of the wafer during thermal processing, or may include modifying the heat-treating of the wafer, for example.</p>
申请公布号
WO2009137940(A1)
申请公布日期
2009.11.19
申请号
WO2009CA00681
申请日期
2009.05.15
申请人
MATTSON TECHNOLOGY CANADA, INC.;CAMM, DAVID, MALCOLM;CIBERE, JOSEPH;STUART, GREG;MCCOY, STEVE
发明人
CAMM, DAVID, MALCOLM;CIBERE, JOSEPH;STUART, GREG;MCCOY, STEVE