| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor sealing epoxy resin composition having excellent adhesiveness to a lead frame, especially to a lead frame plated with nickel/palladium/gold (Ni/Pd/Au), and a semiconductor device obtained using it. Ž<P>SOLUTION: This invention relates to a semiconductor sealing epoxy resin composition containing components: (A) an epoxy resin, (B) a phenol/novolak resin, (C) an inorganic filler, and (D) a polylactone-polyorganosiloxane-polylactone triblock copolymer. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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