发明名称 LIQUID MATERIAL CURING METHOD AND LIQUID MATERIAL CURING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a liquid material curing method by which a liquid material applied on a fine region on a substrate is cured for a short time at a low cost without giving distortion to the substrate. Ž<P>SOLUTION: A defect correcting method is carried out by applying correcting ink 5 on a white defect 3, irradiating the applied correcting ink 5 with ultraviolet ray and infrared ray at the same time to cure the correcting ink 5 by the irradiation with the ultraviolet ray and to remove a solvent component in the correcting ink 5 by the irradiation of the infrared ray. The correcting tact time is shortened compared to a conventional one in which the irradiation with the ultraviolet ray and the irradiation with the infrared ray are separately carried out. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009268983(A) 申请公布日期 2009.11.19
申请号 JP20080122267 申请日期 2008.05.08
申请人 NTN CORP 发明人 YAMANAKA AKIHIRO;SHIMIZU SHIGEO;TANAKA KYUGEN
分类号 B05D3/06;B05C9/12;B05D3/02 主分类号 B05D3/06
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