| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexible organic semiconductor device, and to provide an element substrate. SOLUTION: The method of manufacturing an organic semiconductor device 11 comprises steps of: producing an element substrate 1 by fixing a shielding substrate 6 formed of a glass substrate to one main surface 4a of a flexible resin substrate 4 and making a support substrate 2 formed of a glass substrate adhere to the other main surface 4b of the resin substrate 4; forming an organic semiconductor element 12 that is an organic EL element having an organic semiconductor layer 14 on the shielding substrate 6 of the element substrate 1; and removing the support substrate 2 from an element substrate 1A. COPYRIGHT: (C)2010,JPO&INPIT
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