ELECTRONIC COMPONENT FORMING APPARATUS, ELECTRONIC COMPONENT FORMED WITH IT AND FORMING METHOD THEREOF

摘要

An electronic component forming apparatus for forming an electronic component by radiating light to a photosensitive conductive resin provided on a forming work material, comprising radiation device for radiating light to the forming work material, detection device for detecting reflecting light reflected from the forming work material, and control device for controlling the radiating light responsive to an amount of the light detected by the detection device.