| 摘要 |
A method of reworking a chip includes providing a first chip and a second chip. The first and second chips have at least one first module and at least one second module, respectively. The first and second modules electrically connect with each other. The first module of the first chip has a defect. The second module of the second chip has a defect. The first module having a defect of the first chip is opened with the second module of the first chip, and the second module having a defect of the second chip is opened with the first module of the second chip. The first and second chips are stacked, and the second module of the first chip is electrically connects with the first module of the second chip. |
