| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wire bonding connection type chip resistor which has sufficient strength and superior heat dissipation properties. <P>SOLUTION: The chip resistor A having a laminar resistance element 1 and includes an insulating base 3 bonded to one surface of the resistance element 1 to support the whole resistance element 1, and a projection film 4 covering part of the resistance element 1 from above the base 3 so as to expose both edges 1A of the resistance element 1 as electrode pad parts for wire bonding. The resistance element 1 has a cut 1a formed. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
