| 摘要 |
PROBLEM TO BE SOLVED: To seal a SAW device with a sheet-like resin in such a manner as to ensure a space of an appropriate size around an IDT electrode of the device. SOLUTION: An assembled insulation substrate 1 on which flip-chip mounted chips 2 are mounted is placed on a lower jig 3 with a heater inside a hermetically closed container 6. A protection film 5 is pasted to a portion of a sheet-like resin 4 opposite from a portion to be brought into contact with the outer surfaces of the chips 2, and the sheet-like resin 4 larger than the surface area of the assembled insulation substrate 1 is so placed as to cover the top faces of the chips 2. Then, an upper jig 7 with a heater is placed on the top face of the protection film 5 of the sheet-like resin 4. After the inside of the hermetically closed container 6 is evacuated, the sheet-like resin 4 is heated up to a predetermined temperature by the heaters of the upper jig 7 and lower jig 3. At a point of time when the sheet-like resin 4 is softened, the sheet-like resin 4 is pressed by a pressurization press 9. The softened sheet-like resin 4 is kept being pressed until it is hardened. Thereafter, the vacuum state of the inside of the hermetically closed container 6 is canceled and the upper jig 7 is raised to cancel the pressurization, and then the assembled insulation substrate 1 is taken out of the hermetically closed container 6. COPYRIGHT: (C)2010,JPO&INPIT |
