发明名称 PLATING TREATMENT LINE
摘要 PROBLEM TO BE SOLVED: To provide a plating treatment line which automatically performs various plating pretreatments and plating treatments by charging workpieces to be treated onto a conveyer and therefore has improved production efficiency. SOLUTION: A plurality of surface treatment devices (electrolytic etching treatment device 72, anodization device 73, and plating treatment device 74) for performing surface treatment of an inner circumferential surface of a cylinder of each cylinder block by introducing a treatment solution onto the inner circumferential surface of the cylinder are installed. A roller conveyer 75 for transferring the cylinder blocks is continuously disposed linearly or curvedly between the surface treatment devices (degreasing/wetting device 71, electrolytic etching treatment device 72, anodization treatment device 73, and plating treatment device 74). Each surface treatment device has a positioning means for positioning each cylinder block transferred by the roller conveyer to a predetermined position, and a plating pretreatment or plating treatment as surface treatment can be applied to each cylinder block positioned to the predetermined position. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009270182(A) 申请公布日期 2009.11.19
申请号 JP20080124252 申请日期 2008.05.12
申请人 SUZUKI MOTOR CORP 发明人 ASO TOMOHIRO;KUNIOKA SEIYA;MURAMATSU HITOSHI;SUZUKI NOBUYUKI;ISHIBASHI AKIRA;IMAI MINORU;SUZUKI MANABU;OGAWA MASAHIRO
分类号 C25D17/06;C25D19/00;C25D21/00 主分类号 C25D17/06
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