| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyolefin resin foam that is suitable for use as a packaging material for precision electronic equipment such as electronic products, precision equipment, circuit boards, silicon semiconductors, glass substrates for displays or the like and can impart an excellent cleaning capability when contaminants on the surface of precision electronic equipment is cleaned by washing with water, wiping with a cloth dampened with water or the like even if foreign matter is transferred onto the precision electronic equipment. SOLUTION: The polyolefin resin foam is characterized in that a hydrophilic compound having a hydrophilic-lipophilic balance (an HLB value) of 8-20 is added into the polyolefin resin foam in an amount of 0.5-10 pts.wt. based on 100 pts.wt. polyolefin resin constituting the foam. COPYRIGHT: (C)2010,JPO&INPIT |
