发明名称 SURFACE MOUNTING TYPE ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a surface mounting type electronic component coping with increasing identification information without preventing miniaturization thereof. Ž<P>SOLUTION: This surface mounting type electronic component includes a ceramic base 1 mounted with an electronic component element and a lid 2 hermetically sealing the mounted electronic component element. At least identification information different from each other in signage is formed on a top surface portion of the lid and a bottom surface portion of the ceramic base. In the identification information M4 formed on the bottom surface portion of the ceramic base, individual information and encrypted information of the housed electronic component element are described by irradiating beam. This identification information is formed at a position between functional electrode terminal pads 11 and 13 which are formed on the bottom surface of the ceramic base and not connected to each other. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009272516(A) 申请公布日期 2009.11.19
申请号 JP20080123048 申请日期 2008.05.09
申请人 DAISHINKU CORP 发明人 KOTAKARI SHUJI
分类号 H01L23/00;H03H9/02 主分类号 H01L23/00
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