| 摘要 |
A light-emitting diode module with a heat dissipating structure includes a metal substrate and a plurality of light-emitting diode dies mounted on a face of the metal substrate. A jacket has a coupling surface engaged with the other face of the metal substrate. A heat conduction pipe includes a portion received in a longitudinal hole of the jacket. The coupling surface of the jacket has an opening in communication with the longitudinal hole. A portion of an outer periphery of the portion of the heat conduction pipe is in direct, thermal contact with the other face of the metal substrate through the opening of the jacket to absorb heat generated by the light-emitting diode dies. A finned heat sink is mounted on another portion of the heat conduction pipe outside the jacket to dissipate heat transferred to the heat conduction pipe into the environment.
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