| 摘要 |
A semiconductor device with improved power noise is provided to embody stabilized power noise reducing effect with respect to frequencies by forming a stub for removing power noise in addition to a printed circuit board. An electrical device is formed on a first power plate(104). The first power plate is covered with a second insulation layer(106). One or more stubs(112) of a fan shape are formed on the second insulation layer, electrically connected to the first power plate through a via contact(108) penetrating the second insulation layer. The via contact can vertically be formed with respect to the first power plate. The stubs can be extended radially with respect to the via contact.
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