发明名称 |
CONDUCTIVE FILM STRUCTURE, FABRICATION METHOD THEREOF, AND CONDUCTIVE FILM TYPE PROBE DEVICE FOR IC |
摘要 |
A method for forming a conductive film structure is provided, which includes providing a flexible insulating substrate, forming a conductive film overlying the flexible insulating substrate, patterning the conductive film to form a plurality of micro-wires overlying the flexible insulating substrate, wherein the micro-wires are extended substantially parallel to each other, forming an insulating layer overlying the flexible insulating substrate and the micro-wires, and winding or folding the flexible insulating substrate along an axis substantially parallel to an extending direction of the micro-wires to form a conducting lump.
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申请公布号 |
US2009284275(A1) |
申请公布日期 |
2009.11.19 |
申请号 |
US20080323422 |
申请日期 |
2008.11.25 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
CHOU MIN-CHIEH;WU TUNG-CHUAN;TSAI JEN-HUI;LIN HUNG-YI |
分类号 |
G01R1/073;G01R3/00;H01B5/14 |
主分类号 |
G01R1/073 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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