METHOD FOR FORMING A PAD REDISTRIBUTION PATTERN OF WAFER LEVEL PACKAGE

摘要

A method for forming a pad redistribution pattern of a wafer level package is provided to lower the entire height of a pad redistribution pattern by designing a first interlayer dielectric of a convexo-concave structure. A semiconductor chip(100) having a bonding pad(102) is prepared. A first interlayer dielectric(104) of a convexo-concave structure is formed on the semiconductor chip, exposing the bonding pad. A seed metal layer(106) is deposited on the front surface of the semiconductor chip. A photoresist pattern is formed on the concave part of the first interlayer dielectric. A pad redistribution pattern(114) is formed in the seed metal layer exposed by the photoresist pattern and a re-exposure process is performed to form a gap. A sidewall passivation layer(116) is formed in the gap formed by the re-exposure process. The photoresist pattern is removed, and the exposed seed metal layer is removed. A part of the first interlayer dielectric in which the pad redistribution pattern is formed can become a convex part, and a part of the first interlayer dielectric in which the photoresist pattern is formed can become a concave part.