| 摘要 |
A photosensitive glass paste that can be fired at a low temperature for a short period of time and that can suppress generation of voids and diffusion of Ag in glass layers formed by firing, and a high-performance multilayer wiring chip component manufactured by using the above photosensitive glass paste are provided. As a sintering aid glass which is combined with a ceramic aggregate and a primary glass, a glass having a contact angle to the ceramic aggregate smaller than that of the primary glass to the ceramic aggregate is used, and the content of the sintering aid glass is set to 5 to 10 percent by volume of the inorganic component. As the sintering aid glass, a glass containing SiO2, B2O3, CaO, Li2O, and ZnO at a predetermined ratio is preferably used. As the primary glass, a glass containing 70 to 90 percent by weight of SiO2, 15 to 20 percent by weight of B2O3, and 1 to 5 percent by weight of K2O can be used.
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