CLEANING PROCESS AND APPARATUS

摘要

A method for cleaning an article (110) held by support, the method comprising the steps of applying an accustic wave to said article and support, rotating said article and support such that an area on the article previously masked by the support is exposed to said acoustic wave. Also disclosed is a cleaning module for cleaning at least one substrate (110), the module comprising at least one brush (403) operable to move along a radial path in relation to the at least one substrate. Further disclosed are inlet assemblies and particle collection assemblies for wet processing of wafers.