发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANAGING THE SAME, AND SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To enable management of a semiconductor device comprising a plurality of semiconductor chips by managing information about the plurality of semiconductor chips included in the semiconductor device in a simple and convenient manner. Ž<P>SOLUTION: A semiconductor manufacturing apparatus 102 creates a ROM-mounted semiconductor wafer 104 having a pattern of a plurality of ROM-mounted semiconductor chips each having a ROM and a semiconductor wafer without ROMS 106. The semiconductor manufacturing apparatus 102 also writes individual identifying information about the ROM-mounted semiconductor chips in the associated ROMs. An assembling device 108 mounts semiconductor chips extracted from the ROM-mounted semiconductor wafer 104 and semiconductor chips extracted from the semiconductor wafer without ROMS 106 to a lead frame 118. Upon the mounting, the assembling device 108 transmits ROM chip information 114 and normal chip information 116 to a manufacture system server 110. The manufacture system server 110 combines the ROM chip information 114 and the normal chip information 116 to generate combination information 112 and stores the combination information 112 therein. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009272537(A) 申请公布日期 2009.11.19
申请号 JP20080123432 申请日期 2008.05.09
申请人 MURATA MFG CO LTD 发明人 MORI AKIRA;KATO YOSHITAKA
分类号 H01L21/02;H01L21/50 主分类号 H01L21/02
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