| 摘要 |
A mounting material alignment plate of the present invention is operative to allow an electronic component to be mounted on a printed circuit board and has a plurality of bores that admit terminals of the electronic component to be placed. The mounting material alignment plate has dents formed on one surface, on which the electronic component is located, around the individual bores, and recesses formed on another surface opposite to the one surface on which the electronic component is located.
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