发明名称 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition which is excellent in resolution, insulation, flatness, chemical resistance and adhesive force and exhibits superior sensitivity, film retention and UV transmittance particularly in the formation of organic insulating films of a high-aperture-ratio liquid crystal display and a reflective liquid crystal display as compared with conventional photosensitive resins, whereby it is suitable for use as organic insulating films. <P>SOLUTION: The negative photosensitive resin composition comprises (a) an acrylic copolymer obtained by copolymerizing (i) an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride or a mixture of these, (ii) an epoxy group-containing unsaturated compound, and (iii) an olefinic unsaturated compound, (b) a photoinitiator comprising 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazoyl-3-yl]-1-(O-acetyloxime), (c) a polyfunctional monomer having an ethylenically unsaturated bond, (d) a silicon-based compound having an epoxy group or an amine group, and (e) a solvent. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009271532(A) 申请公布日期 2009.11.19
申请号 JP20090110352 申请日期 2009.04.30
申请人 DONGJIN SEMICHEM CO LTD 发明人 KIM BYUNG UK;YOUN HYOC MIN;KIM DONG-MYUNG;CHOI SANG GAK;KOO KI HYUK;YEO TAE HOON;YUN JOO PYO;SHIN HONG DAE;CHOI SU YOUN;KIM CHINZEN;RI SOKUN
分类号 G03F7/033;C08F2/44;C08F2/48;C08F265/00;G02F1/1333;G03F7/004;G03F7/031;G03F7/075 主分类号 G03F7/033
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