发明名称 |
SELENIUM ELECTROPLATING CHEMISTRIES AND METHODS |
摘要 |
An electroplating solution to electroplate a selenium containing film on a conductive surface is provided. The electroplating solution includes a solvent, a selenium source material that dissolves in the solvent; an anti-coagulation agent that inhibits Se particle growth and promotes Se particle dispersal. The pH value of the electroplating solution is in the range of 2-10.
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申请公布号 |
US2009283411(A1) |
申请公布日期 |
2009.11.19 |
申请号 |
US20080121687 |
申请日期 |
2008.05.15 |
申请人 |
AKSU SERDAR;HAN YONGBONG;BASOL BULENT M |
发明人 |
AKSU SERDAR;HAN YONGBONG;BASOL BULENT M. |
分类号 |
C25D15/00 |
主分类号 |
C25D15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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