发明名称 SELENIUM ELECTROPLATING CHEMISTRIES AND METHODS
摘要 An electroplating solution to electroplate a selenium containing film on a conductive surface is provided. The electroplating solution includes a solvent, a selenium source material that dissolves in the solvent; an anti-coagulation agent that inhibits Se particle growth and promotes Se particle dispersal. The pH value of the electroplating solution is in the range of 2-10.
申请公布号 US2009283411(A1) 申请公布日期 2009.11.19
申请号 US20080121687 申请日期 2008.05.15
申请人 AKSU SERDAR;HAN YONGBONG;BASOL BULENT M 发明人 AKSU SERDAR;HAN YONGBONG;BASOL BULENT M.
分类号 C25D15/00 主分类号 C25D15/00
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