| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for a rigid printed wiring board suitably used in the use of a rigid printed wiring board, particularly a semiconductor package. <P>SOLUTION: The photosensitive resin composition for a rigid printed wiring board comprises a carboxyl group-containing photosensitive urethane resin (A) and a photopolymerization initiator (B), wherein the carboxyl group-containing photosensitive urethane resin (A) is a resin prepared by reacting a carboxyl group-containing urethane prepolymer (a), obtained by reacting a polymer polyol (e), a carboxylic acid compound (f) having two hydroxyl groups per molecule, and a diisocyanate compound (g) as essential components, with a compound (b) having an ethylenically unsaturated group, and reacting the resultant hydroxyl group-containing urethane prepolymer (c) with an acid anhydride group-containing compound (d). <P>COPYRIGHT: (C)2010,JPO&INPIT |
