| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate film having modified adhesiveness which is reduced in process contamination caused by powder scattering and reduced in the detachment of particles, not noticeable in interference spots when a hard coat layer is laminated, and has excellent adhesiveness. <P>SOLUTION: The substrate film having modified adhesiveness is composed of a substrate film composed of a thermoplastic resin film practically free of particles and an adhesiveness-modifying layer laminated on at least one side of the substrate film. The adhesiveness-modifying layer contains at least one resin selected from a polyester type, and urethane type and acrylic resins and inorganic particles and has a coverage of 3-12 mg/m<SP>2</SP>and an average of maximum sizes of ≥10 μm for foots of crests of surface protrusions higher than 100 nm. <P>COPYRIGHT: (C)2010,JPO&INPIT |
