| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component that reduces an effect of stress on cooling-heating cycle, etc. SOLUTION: The electronic component includes an insulating member 22 to be mounted with the electronic device 20; and a thermal diffusion member 24 to be mounted with the insulating member 22. A thermal expansion coefficient of the insulating member 22 is lower than that of the thermal diffusion member 24, and the electronic component is mounted such that the insulating member 22 is embedded in a recess 24b formed on a surface of the thermal diffusion member 24. COPYRIGHT: (C)2010,JPO&INPIT |
