ABRASIVE, SUBSTRATE POLISHING METHOD USING SAME, AND SOLUTION AND SLURRY FOR USE IN THIS METHOD

摘要

PROBLEM TO BE SOLVED: To provide an abrasive which is capable of achieving both the reduction of polishing scratches and an excellent polishing speed in a sufficiently high level and gives a sufficiently high polishing speed ratio between a target film to be polished and a stopper film, in CMP techniques for polishing the target film formed on a surface of a substrate.

SOLUTION: The abrasive contains cerium oxide particles and an additive, wherein the additive contains a compound having an amide structure and a carboxyl group.

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