发明名称 HIGH FREQUENCY STORING CASE AND HIGH FREQUENCY MODULE
摘要 A high frequency storing case is provided with a cavity (5) wherein a grounding conductor (4), which is formed on a multilayer dielectric substrate (2) and has a plurality of high frequency circuits (10, 11, 12) mounted on the grounding conductor, and a shield cover material (3) are electrically connected; a waveguide tube opening (30), which is formed on the grounding conductor (4) whereupon the high frequency circuits (10, 11, 12) are mounted and is electrically coupled with the cavity (5); and a dielectric waveguide tube (40) having a short-circuiting leading end, which is formed in the laminating direction of the multilayer dielectric substrate (2), connected to the waveguide tube opening (30) and has a length substantially 1/4 of the effective wavelength of a signal wave in the substrate. Spatial isolation among the high frequency circuits is ensured by low-cost and simple configuration wherein the single cavity is used.
申请公布号 WO2009139210(A1) 申请公布日期 2009.11.19
申请号 WO2009JP53593 申请日期 2009.02.26
申请人 MITSUBISHI ELECTRIC CORPORATION;SUZUKI, TAKUYA 发明人 SUZUKI, TAKUYA
分类号 H01L23/02;H01L23/12;H01L25/04;H01L25/18 主分类号 H01L23/02
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