SEMICONDUCTOR-SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING IT

摘要

<P>PROBLEM TO BE SOLVED: To provide a semiconductor-sealing resin composition excellent in operability in deburring, various reliability and moldability. Ž<P>SOLUTION: The semiconductor-sealing resin composition contains the following component (D) in addition to the following components (A) to (C): (A) an epoxy resin; (B) a phenolic resin; (C) an inorganic filler; and (D) a silicone resin containing an alkoxy group directly linking to silicon of 10 to 30 wt.% based on the total amount of the silicone resin. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž