摘要 |
In a harmonica type head chip having a plurality of rows of channels (row A and row B), connection electrodes for row A and the connection electrodes for row B formed on the back surface of the head chip are connected to a multilayer member having an insulating layer on one surface of which are formed the lead wirings for row A and on the other surface of which are formed the lead wirings for row B, and the lead wirings for row B are made to protrude outwards more than the lead wirings for row A and drive interconnections are electrically connected to the lead wirings for row A and the lead wirings for row B.
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