发明名称 HEAT DISSIPATION DEVICE
摘要 A securing structure of a heat dissipation device for an electronic component includes a fastener and a securing arm. The fastener includes a bolt and a spring surrounding the bolt. The bolt includes a main portion, a bottom fixing portion and a top head portion. An aperture extends inwardly from a free end of the securing arm with a width not smaller than the main portion and smaller than the fixing portion. The main portion of the bolt is received in the aperture with the spring compressed between an upper surface of the securing arm and the head portion, and the fixing portion abutting a lower surface of the securing arm. An engaging portion extends perpendicularly from the securing arm around the aperture and engages with the fastener to hold the fastener in the aperture of the securing arm.
申请公布号 US2009283243(A1) 申请公布日期 2009.11.19
申请号 US20080261044 申请日期 2008.10.30
申请人 FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD. 发明人 ZHA XIN-XIANG
分类号 F28F7/00;F16B21/00 主分类号 F28F7/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利