| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent an electric fault due to the occurrence of migration and connection of melted solder between lands. Ž<P>SOLUTION: A printed circuit board 1 includes a board circuit 5 formed in a substrate 3, the land parts 11 arranged in the board circuit 5, carbon parts 13 formed of carbon formed at an outer periphery of the land part 11 or between the adjacent land parts 11 or of a material which is mainly composed of carbon, and a mounting component 19 connected to the adjacent land part 11 by solder 17. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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