| 摘要 |
Provided are a facing target sputtering system and a method effective for each material wherein the pattern of a magnetic line of force can be varied easily between facing targets, and a plurality of types of sputtering, e.g. facing-mode facing target sputtering, compound-(facing plus magnetron) mode facing target sputtering, and the like, can be carried out easily. A sputtering system for depositing a thin film wherein a pair of target holders (2) each holding a target (1) are arranged so as to face each other, wherein a magnetic pole group consisting of a plurality of magnetic pole elements having at least different directions of magnetic pole is arranged on the back side of each target holder, the magnetic pole element is any of a permanent magnet (4), yokes (7, 8), an electromagnet (13), or a combination thereof, and a flux line pattern control means is provided for varying a flux line pattern (5) between targets arranged opposite to each other by moving at least a part of the magnetic pole elements or varying at least the strength or direction of magnetic field. |
