PRESSURE-SENSITIVE ADHESIVE SHEET, METHOD OF PROCESSING ADHEREND WITH THE PRESSURE-SENSITIVE ADHESIVE SHEET, AND APPARATUS FOR STRIPPING PRESSURE-SENSITIVE ADHESIVE SHEET

摘要

A pressure-sensitive adhesive sheet which comprises the following layers superposed in the following order: a base layer (A) in which the product of the Young's modulus as measured at 25°C and the thickness of the base is 1.0×105 to 4.0×105 N/m and the product of the Young's modulus as measured at 80°C and the thickness of the base is 2.8×105 N/m or smaller; a pressure-sensitive adhesive layer (A) which has a shearing modulus as measured at 80°C of 0.2 MPa or lower; a base layer (B) in which the product of the Young's modulus as measured at 25°C and the thickness of the base is smaller than the product of the Young's modulus of the base layer (A) as measured at 25°C and the thickness of the base and which has a degree of MD shrinkage and a degree of TD shrinkage through 80°C heating of 20% or higher each; and a pressure-sensitive adhesive layer (B) which has a Young's modulus as measured at 80°C of 10 MPa or higher and an adhesive force in application to a wafer of 0.2 N/10 mm or less.