| 摘要 |
PROBLEM TO BE SOLVED: To provide a breaking device and a breaking method for a filmy adhesive that prevent a fragment produced as a projection portion of the filmy adhesive is broken from sticking on a wafer surface. SOLUTION: The breaking device includes: a frame holding means 2 of holding an annular frame 12; an expanding means 3 of expanding a protection tape 13; a forward/backward moving means 4 of relatively positioning the expanding means 3 and a holding surface of the frame holding means 2; and a cooling means 6 of cooling the filmy adhesive 10, and breaks the filmy adhesive 10 stuck on the reverse surface of the wafer 11 in a state wherein the filmy adhesive 10 is stuck on the protection tape 13 mounted on an opening 12a of the annular frame 12. The breaking device is also provided with an air blow means 5 of blowing air to the wafer 11 from its inner side to its outer side at least when the protection film 13 is expanded. COPYRIGHT: (C)2010,JPO&INPIT
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