| 摘要 |
PROBLEM TO BE SOLVED: To provide a pickup device of a semiconductor die which suppresses a force applied to the semiconductor die upon peeling a holding sheet, and picks up the semiconductor die easily. SOLUTION: This pickup device includes: a stage 20 containing a bond face 22 bonded to a holding sheet 12; a suction opening 41 formed at the bond face 22; a lid 23 sliding along the bond face 22 for opening and closing the suction opening 41; and a collet 18 for sucking a semiconductor die 15. Upon picking up a semiconductor die 15, a forefront 23a of the lid 23 is advanced from the bond face 22, and while the holding sheet 12 and the semiconductor die 15 are pushed up, the lid 23 is slid to open the suction openings 41 successively. The holding sheets 12 are successively sucked to the opened suction openings 41 to peel off the holding sheet 12 from the semiconductor die 15 successively, and also the semiconductor dies 15 are successively sucked to the collet 18 waiting immediately above the semiconductor die 15 to pick up the semiconductor die 15. COPYRIGHT: (C)2010,JPO&INPIT
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