| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed circuit board by which a fine conductor pattern is formed inexpensively. Ž<P>SOLUTION: Firstly, a catalyst 2 for performing electroless plating in a subsequent step is caused to adhere to surfaces of uneven portions 1a of a matrix 1. Next, an insulating layer 3 made of a resin material is prepared. Then, the insulating layer 3 is heated to be softened while the uneven portions 1a of the matrix 1 are pressed against one surface of the insulating layer 3. Thus, grooves R2 corresponding to shapes of the uneven portions 1a of the matrix 1 are formed in the insulating layer 3 while the catalyst 2 is transferred to bottom surfaces and side surfaces of the grooves R2. The insulating layer 3 is then subjected to the electroless plating. In this case, metal is deposited by reduction reaction on portions of the insulating layer 3 where the catalyst 2 exists. Accordingly, conductor patterns 4 are formed in the grooves R2 of the insulating layer 3. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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