| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for padding that forms a hole part insulating layer and a solder mask, which are excellent in insulating reliability, heat resistance and the like, without a problem that a delamination occurs in a peripheral part of the hole part insulating layer under a high temperature condition, to provide a combination unit of a photo-curing thermosetting resin composition for forming a solder mask layer, and to provide a printed wiring board using the same. SOLUTION: In this combination unit of the thermosetting resin composition for padding (I) to be charged into a hole part of the printed wiring board, and the photo-curing thermosetting resin composition (II) for forming a solder mask which is formed in contact with the hole part insulating layer composed of a cured material of the thermosetting resin composition for padding, the thermosetting resin composition for padding (I) contains an inorganic filler (I-C) composed of a salt of an element of a group IIa in a periodic table at least at a ratio of 40 to 85 wt.% to a total amount of the composition, and the photo-curing and the thermosetting resin composition (II) for forming the solder mask contains a photopolymerization initiator having a decomposition temperature of≥250°C. COPYRIGHT: (C)2010,JPO&INPIT
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