PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a package in which even though an IC part for radio communication is provided on the package that has a metal layer, deterioration in communication is minimized, and to provide a manufacturing method for conveniently manufacturing such a package. SOLUTION: The body part 10 of the package is formed with a cut part 15 notched in a substantially circular shape so as to have a side edge opening 15a. An IC part 30 is attached to the cut part 15 such that the entire area of the IC body 32 of the IC part 30 is located in the cut part 15 of the package body part 10. The cut part 15 of the package body part 10 admits passage of electric wave and magnetic flux in the thickness direction of a metal layer (side face sheet), and also admits transmission of electric wave and magnetic flux in the planar direction of the metal layer (side face sheet). COPYRIGHT: (C)2010,JPO&INPIT